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XCZU21DR-2FFVD1156E芯片詳細(xì)信息

• Manufacturer Part Number:

XCZU21DR-2FFVD1156E

• Rohs Code:

Yes

• Part Life Cycle Code:

Active

• Package Description:

FCBGA-1156

• Reach Compliance Code:

compliant

• ECCN Code:

5A002.A.4

• HTS Code:

8542.39.00.01

• Date Of Intro:

2017-12-19

• Manufacturer:

Xilinx

• Risk Rank:

5.81

• JESD-30 Code:

R-PBGA-B1156

• JESD-609 Code:

e1

• Moisture Sensitivity Level:

4

• Number of Terminals:

1156

• Operating Temperature-Max:

100 °C

• Package Body Material:

PLASTIC/EPOXY

• Package Code:

BGA

• Package Shape:

RECTANGULAR

• Package Style:

GRID ARRAY

• Peak Reflow Temperature (Cel):

NOT SPECIFIED

• Supply Voltage-Max:

0.876 V

• Supply Voltage-Min:

0.825 V

• Supply Voltage-Nom:

0.85 V

• Surface Mount:

YES